Invention Grant
- Patent Title: Micro chip-scale-package system
- Patent Title (中): 微芯片级封装系统
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Application No.: US11869737Application Date: 2007-10-09
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Publication No.: US07652382B2Publication Date: 2010-01-26
- Inventor: Jong Kook Kim , Hun Teak Lee , Jason Lee
- Applicant: Jong Kook Kim , Hun Teak Lee , Jason Lee
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/00
Abstract:
A micro chip-scale-package system including providing a metal pattern on an adhesion material, attaching an integrated circuit die to the metal pattern, and molding an encapsulant over the integrated circuit die and the metal pattern.
Public/Granted literature
- US20080029861A1 MICRO CHIP-SCALE-PACKAGE SYSTEM Public/Granted day:2008-02-07
Information query
IPC分类:
