Invention Grant
- Patent Title: Semiconductor device and audio processor chip
- Patent Title (中): 半导体器件和音频处理器芯片
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Application No.: US11935419Application Date: 2007-11-06
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Publication No.: US07652605B2Publication Date: 2010-01-26
- Inventor: Koji Doi
- Applicant: Koji Doi
- Applicant Address: JP Kanagawa
- Assignee: NEC Electronics Corporation
- Current Assignee: NEC Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Young & Thompson
- Priority: JP2006-302765 20061108
- Main IPC: H03M1/66
- IPC: H03M1/66

Abstract:
An audio processor chip includes a DSP for decoding audio data, a first DAC for performing a D/A conversion to the digital data obtained from the DSP, a PLL circuit for generating a clock signal for the first DAC to supply it to the first DAC and a clock output external terminal for outputting the clock signal obtained from the PLL circuit to a second DAC of an AFE. The first DAC 142 outputs an analog signal obtained from the D/A conversion to an analog mixer and the analog mixer performs a mixing process to the analog signal to output.
Public/Granted literature
- US20080106449A1 SEMICONDUCTOR DEVICE AND AUDIO PROCESSOR CHIP Public/Granted day:2008-05-08
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