Invention Grant
- Patent Title: Modular component and blank coupling
- Patent Title (中): 模块组件和空白耦合
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Application No.: US11611587Application Date: 2006-12-15
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Publication No.: US07652879B2Publication Date: 2010-01-26
- Inventor: Corey Hartman , Raymond DeWine Heistand, II , Joel J. Jaramillo , Andrew T. Junkins
- Applicant: Corey Hartman , Raymond DeWine Heistand, II , Joel J. Jaramillo , Andrew T. Junkins
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Haynes and Boone, LLP
- Main IPC: G06F1/16
- IPC: G06F1/16 ; A47B81/00 ; A47F7/00

Abstract:
A modular component and blank coupling apparatus includes a chassis having a wall. A component bay is defined by the chassis and is located adjacent the wall. A plurality of guide channels are defined by the wall and are located adjacent the component bay. A single securing member is moveably coupled to the wall adjacent the plurality of guide channels, wherein the single securing member is operable to move into engagement with a modular component and a blank in order to secure the modular component and the blank to the chassis, and wherein the single securing member is operable to move out of engagement with the modular component and the blank in order to allow the modular component and the blank to be removed from the chassis. The single securing member provides one apparatus that may be used to couple both blanks and modular components to the chassis, and provides a single release mechanism to release those modular components and blanks from the chassis.
Public/Granted literature
- US20080144271A1 Modular Component and Blank Coupling Public/Granted day:2008-06-19
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