Invention Grant
US07653105B2 Semiconductor laser, method of manufacturing semiconductor laser, optical pickup and optical disk system 有权
半导体激光器,半导体激光器的制造方法,光学拾取器和光盘系统

  • Patent Title: Semiconductor laser, method of manufacturing semiconductor laser, optical pickup and optical disk system
  • Patent Title (中): 半导体激光器,半导体激光器的制造方法,光学拾取器和光盘系统
  • Application No.: US11936431
    Application Date: 2007-11-07
  • Publication No.: US07653105B2
    Publication Date: 2010-01-26
  • Inventor: Masaru Kuramoto
  • Applicant: Masaru Kuramoto
  • Applicant Address: JP Tokyo
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Sonnenschein Nath & Rosenthal LLP
  • Priority: JP2006-303672 20061109
  • Main IPC: H01S5/00
  • IPC: H01S5/00
Semiconductor laser, method of manufacturing semiconductor laser, optical pickup and optical disk system
Abstract:
A semiconductor laser using a nitride type Group III-V compound semiconductor includes: an n-side clad layer; an n-side optical waveguide layer over the n-side clad layer; an active layer over the n-side optical waveguide layer; a p-side optical waveguide layer over the active layer; an electron barrier layer over the p-side optical waveguide layer; and a p-side clad layer over the electron barrier layer. A ridge stripe is formed at an upper part of the p-side optical waveguide layer, the electron barrier layer and the p-side clad layer, and the distance between the electron barrier layer and a bottom surface in areas on both sides of the ridge stripe is not less than 10 nm.
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