Invention Grant
US07653110B2 Semiconductor laser apparatus and method for mounting semiconductor laser apparatus
失效
半导体激光装置及半导体激光装置的安装方法
- Patent Title: Semiconductor laser apparatus and method for mounting semiconductor laser apparatus
- Patent Title (中): 半导体激光装置及半导体激光装置的安装方法
-
Application No.: US12149040Application Date: 2008-04-25
-
Publication No.: US07653110B2Publication Date: 2010-01-26
- Inventor: Shinichi Nakatsuka , Tsukuru Ootoshi
- Applicant: Shinichi Nakatsuka , Tsukuru Ootoshi
- Applicant Address: JP Tokyo
- Assignee: Ricoh Company, Ltd.
- Current Assignee: Ricoh Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JPP2007-117997 20070427
- Main IPC: H01S3/00
- IPC: H01S3/00 ; H01S5/00

Abstract:
According to an aspect of the present invention, there is provided a semiconductor laser apparatus including: a laser device including: a semiconductor substrate, first and second resonators formed on the semiconductor substrate, and first and second electrodes that are respectively connected with the first and the second resonators and extend away from each other; and a submount including: third and fourth electrodes respectively adhered with the first and the second electrodes; wherein each of the first and the second electrodes includes: an energizing portion covering the corresponding resonator, an adhering portion being disposed separately from the energizing portion and having a height larger than that of the energizing portion, and a stress-absorbing portion formed in the adhering portion.
Public/Granted literature
- US20080279246A1 Semiconductor laser apparatus and method for mounting semiconductor laser apparatus Public/Granted day:2008-11-13
Information query