Invention Grant
- Patent Title: Thermal management of extruder of molding system, amongst other things
- Patent Title (中): 成型系统挤出机的热管理等
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Application No.: US11503683Application Date: 2006-08-14
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Publication No.: US07653460B2Publication Date: 2010-01-26
- Inventor: Jan Marius Manda , Robert Domodossola
- Applicant: Jan Marius Manda , Robert Domodossola
- Applicant Address: CA Bulton, Ontario
- Assignee: Husky Injection Molding Systems Ltd.
- Current Assignee: Husky Injection Molding Systems Ltd.
- Current Assignee Address: CA Bulton, Ontario
- Agency: Husky Intellectual Property Services
- Main IPC: G05D23/00
- IPC: G05D23/00 ; B28B17/00 ; B28B13/00 ; D01D5/24

Abstract:
Disclosed is a method of a molding system, the method comprising: determining whether a change in a thermal condition of an extruder is required based on a thermal condition of a zone of a melt passageway of the molding system, wherein setting of a threshold temperature of an extruder heater is adjusted based on a non-extruder sensor positioned away from the extruder but positioned proximate to the melt passageway, the melt passageway is also positioned external of the extruder, so that the non-extruder sensor is not negatively influenced by heat retained in the extruder.
Public/Granted literature
- US20080039970A1 Thermal management of extruder of molding system, amongst other things Public/Granted day:2008-02-14
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