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US07653519B1 Method and mechanism for modeling interconnect structures for integrated circuits 有权
集成电路互连结构建模方法及机制

Method and mechanism for modeling interconnect structures for integrated circuits
Abstract:
Disclosed are methods, systems, and structures for implementing interconnect modeling by using a test structure which include a variation of physical wire structures between local interconnects and distant interconnects. According to one approach, the impact of variations of the physical properties for neighborhood wires are considered for the electrical modeling of interconnects. This variation between the local and distant wire characteristics allows more accurate and robust interconnect modeling to be created.
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