A production method of a multilayer electronic device, comprising the steps of forming an electrode layer 12a on a first support sheet 20; forming a green sheet 10a on a surface of the electrode layer 12a to obtain a green sheet 10a having an electrode layer 12a; stacking the green sheets 10a, each having the electrode layer 12a, to form a green chip; and firing the green chip: wherein before stacking the green sheet 10a having the electrode layer 12a, an adhesive layer 28 is formed on a surface on the opposite side of the electrode layer side of the green sheet 10a having the electrode layer 12a; and the green sheet 10a having the electrode layer 12a formed thereon is stacked via the adhesive layer 28.