Invention Grant
- Patent Title: Contour measuring method for measuring aspects of objects
- Patent Title (中): 轮廓测量方法用于测量物体的各个方面
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Application No.: US11966956Application Date: 2007-12-28
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Publication No.: US07654008B2Publication Date: 2010-02-02
- Inventor: Qing Liu , Jun-Qi Li , Takeo Nakagawa
- Applicant: Qing Liu , Jun-Qi Li , Takeo Nakagawa
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Priority: CN200710201200 20070727
- Main IPC: G01B5/20
- IPC: G01B5/20

Abstract:
An exemplary contour measuring method for measuring aspects of objects includes: (1) providing a contour measuring probe (10) comprising a tip extension (16), a displacement sensor (19), and a processor (119) connected to the displacement sensor, the tip extension being slidable in a first direction; (2) driving the tip extension to move so as to contact with the object at a first predetermined point, and recording a coordinate of the first predetermined point in the processor; (3) driving one of the tip extension and the object to move, thus, the tip extension contacting with the object at a second predetermined point, the displacement sensor sensing a displacement of the tip extension along the first direction and sending the displacement to the processor, and the processor recording a coordinate of the second predetermined point; and (4) repeating the step (3), the processor recording a series of measured coordinates of points.
Public/Granted literature
- US20090030650A1 CONTOUR MEASURING METHOD FOR MEASURING ASPECTS OF OBJECTS Public/Granted day:2009-01-29
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