Invention Grant
- Patent Title: Heat pumped parametric MEMS device
- Patent Title (中): 热泵参数MEMS器件
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Application No.: US10097178Application Date: 2002-03-12
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Publication No.: US07654140B2Publication Date: 2010-02-02
- Inventor: Maxim Zalalutdinov , Anatoli Olkhovets , Alan T. Zehnder , Bojan Ilic , David Alan Czaplewski , Lidija Sekaric , Jeevak M. Parpia , Harold G. Craighead
- Applicant: Maxim Zalalutdinov , Anatoli Olkhovets , Alan T. Zehnder , Bojan Ilic , David Alan Czaplewski , Lidija Sekaric , Jeevak M. Parpia , Harold G. Craighead
- Applicant Address: US NY Ithaca
- Assignee: Cornell Research Foundation, Inc.
- Current Assignee: Cornell Research Foundation, Inc.
- Current Assignee Address: US NY Ithaca
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: G01N29/12
- IPC: G01N29/12

Abstract:
A micro-electrical mechanical oscillator has a resonant frequency of oscillation that is varied by application of heat. The resonant frequency is varied at a frequency different from the resonant frequency of the oscillator to amplify oscillations. In one embodiment, the oscillator is disc of material supported by a pillar of much smaller diameter than the disc. The periphery of the disc is heated by a laser to provide a time varying shift of the resonant frequency (or equivalently the stiffness) of the disc. Feedback from movement of the disc is used to modulate the intensity of the laser, and thus the stiffness of the disc to provide parametric amplification of sensed vibrations, using heating as a pump. Various other shapes of micro-electrical mechanical oscillators are used in other embodiment, including an array of such oscillators on a substrate, each having different resonant frequencies.
Public/Granted literature
- US20030173864A1 Heat pumped parametric MEMS device Public/Granted day:2003-09-18
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