Invention Grant
- Patent Title: Purging apparatus and purging method
- Patent Title (中): 清洗装置和清洗方法
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Application No.: US10554504Application Date: 2004-04-28
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Publication No.: US07654291B2Publication Date: 2010-02-02
- Inventor: Toshihiko Miyajima , Hiroshi Igarashi , Hitoshi Suzuki
- Applicant: Toshihiko Miyajima , Hiroshi Igarashi , Hitoshi Suzuki
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Miaer & Neustadt, L.L.P.
- Priority: JP2003-123792 20030428; JP2003-273267 20030711
- International Application: PCT/JP2004/006162 WO 20040428
- International Announcement: WO2004/097927 WO 20041111
- Main IPC: H01L21/673
- IPC: H01L21/673 ; H01L21/677
Abstract:
It is an object of the present invention to easily and securely perform the removal operation of contaminant or the like from a wafer housed in a FOUP. To achieve the object, a purging apparatus of the present invention removes contaminant or the like from a wafer by moving a gas supply nozzle along a direction in which wafers are superimposed at the front of an opening while a lid of the FOUP is separated from a body and spraying clean gas on each wafer from the gas supply nozzle.
Public/Granted literature
- US20060272169A1 Purging apparatus and purging method Public/Granted day:2006-12-07
Information query
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