Invention Grant
- Patent Title: Method, device and system for bonding a semiconductor element
- Patent Title (中): 用于接合半导体元件的方法，装置和系统
-
Application No.: US11276991Application Date: 2006-03-20
-
Publication No.: US07654434B2Publication Date: 2010-02-02
- Inventor: Dirk Siepe , Reinhold Bayerer , Andreas Lenniger
- Applicant: Dirk Siepe , Reinhold Bayerer , Andreas Lenniger
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Coats & Bennett, P.L.L.C.
- Priority: DE102005012992 20050321
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K31/12
Abstract:
The invention relates to a method and also a device and a system for bonding a semiconductor element (4), in which various contact areas (8) of the semiconductor element (4) are successively connected to terminal areas (2, 3, 7) by means of bonding wire elements (6) and in which an electrical variable influenced by the semiconductor element (4) is acquired during the bonding operation.
Public/Granted literature
- US20060208037A1 Method, Device and System for Bonding a Semiconductor Element Public/Granted day:2006-09-21
Information query
IPC分类:
