Invention Grant
- Patent Title: Method for bonding metallic plates and jig for the bonding of the metallic plates
- Patent Title (中): 用于接合金属板和金属板接合用夹具的方法
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Application No.: US11325334Application Date: 2006-01-05
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Publication No.: US07654437B2Publication Date: 2010-02-02
- Inventor: Atsushi Hirota
- Applicant: Atsushi Hirota
- Applicant Address: JP Nagoya-shi, Aichi-ken
- Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Nagoya-shi, Aichi-ken
- Agency: Baker Botts L.L.P.
- Priority: JP2005-001046 20050106
- Main IPC: B23K31/02
- IPC: B23K31/02

Abstract:
A method for bonding metallic plates includes: sandwiching a laminated body, which includes a plurality of metallic plates and is formed with an inner cavity opening on a surface thereof, between a pair of jigs each having a flat abutment surface abutting against respective surfaces of the laminated body, wherein at least one of the jigs is formed with an atmosphere communication path, which communicates with the inner cavity and atmosphere; and heating the laminated body while applying pressure to the laminated body with the pair of jigs in a lamination direction of the laminated body.
Public/Granted literature
- US20060180638A1 Method for bonding metallic plates and jig for the bonding of the metallic plates Public/Granted day:2006-08-17
Information query
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