Invention Grant
- Patent Title: Wire bundle support system
- Patent Title (中): 电线束支撑系统
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Application No.: US10838049Application Date: 2004-05-03
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Publication No.: US07654492B2Publication Date: 2010-02-02
- Inventor: Mark Balderama , Thomas A. Holum , Lenny E. Lay
- Applicant: Mark Balderama , Thomas A. Holum , Lenny E. Lay
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Alston & Bird LLP
- Main IPC: F16L3/00
- IPC: F16L3/00
Abstract:
A support system for an elongate object comprising an elongate support bar, a tower member, and a stackable riser for securing the elongate object to the tower member.
Public/Granted literature
- US20050242245A1 Wire bundle support system Public/Granted day:2005-11-03
Information query
