Invention Grant
- Patent Title: Endeffectors for handling semiconductor wafers
- Patent Title (中): 用于处理半导体晶圆的处理器
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Application No.: US10781323Application Date: 2004-02-18
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Publication No.: US07654596B2Publication Date: 2010-02-02
- Inventor: Paul Mantz
- Applicant: Paul Mantz
- Applicant Address: US CA Fremont
- Assignee: Mattson Technology, Inc.
- Current Assignee: Mattson Technology, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Dority & Manning, P.A.
- Main IPC: B65G49/07
- IPC: B65G49/07 ; B66C1/02

Abstract:
Various endeffector designs are disclosed for handling semiconductor wafers. For instance, an endeffector for handling wafers at a relatively low temperature is disclosed along with an endeffector for handling wafers at a relatively high temperature. Both endeffectors include uniquely designed support members that are configured to only contact a wafer at the wafer's edge. The endeffectors may also include a wafer detection system. The endeffector for handling wafers at relatively low temperatures may also include a pushing device that is used not only to position a wafer but to hold a wafer on the endeffector during acceleration or deceleration of the endeffector caused by a robot arm attached to the endeffector. As designed, the endeffectors may have a very slim profile making the endeffectors easily maneuverable.
Public/Granted literature
- US20050006916A1 Endeffectors for handling semiconductor wafers Public/Granted day:2005-01-13
Information query
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