An LED lamp includes a lamp frame, a plurality of LED modules, an envelope and a heat sink made of metal. The envelope and the heat sink are mounted on top and bottom sides of the lamp frame. A frame body of the lamp frame is attached to a top face of a base of the heat sink. A heat absorbing member made of metal and provided with a plurality of heat absorbing portions is attached on the top face of the base. The LED modules are attached on top boards of the heat absorbing portions. The envelope engages with the lamp frame and receives the heat absorbing member and the LED modules therein. The top boards are inclined downwards from a middle toward an outside of the heat absorbing member.