An IC socket includes a socket body defining a first receiving cavity with a bottom wall, a cover attached pivotally on one end of the socket body and a locking member for locking the cover to the socket body. The IC socket further includes four detachable aligning elements mounted on four corners of the bottom wall. The four aligning elements have a plurality of positioning surfaces adapted for corporately defining a second receiving cavity for snugly accommodating an IC package therein. Different aligning elements with different dimensions can be replaced to mount on the socket body for different IC packages, thus a cost of manufacturing is reduced.