A probe is provided for testing the electrical characteristics of a device. The probe includes a housing, a plurality of cables, a circuit board located within the housing, and a field-replaceable probe tip. The probe tip includes an array of contacts. Each of the plurality of cables is connected to a corresponding contact. The probe includes a retractable shroud that retracts as the probe is connected to the device. The contacts have bifurcated tips. An alignment assembly for aligning a probe with respect to a device to be tested includes a first alignment block, a second alignment block, and an alignment piece connecting the first alignment block and the second alignment block. The first alignment block and the second alignment block are arranged to be attached to the device to be tested to align the probe with respect to the device to be tested.