Invention Grant
- Patent Title: IC package having improved structure
- Patent Title (中): IC封装具有改进的结构
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Application No.: US12075154Application Date: 2008-03-10
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Publication No.: US07654862B2Publication Date: 2010-02-02
- Inventor: Fang-Chu Liao , Chun-Yi Chang
- Applicant: Fang-Chu Liao , Chun-Yi Chang
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Andrew C. Cheng; Wei Te Chung; Ming Chieh Chang
- Priority: CN200720035282 20070309
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
An electrical connector assembly comprises an insulative housing having a base, with a mating interface, and a mounting interface corresponding to the mating face. The base has peripheral walls extending upwardly from the mating face. A plurality of contacts arranged in the base of the insulative housing. At least a pair of cantilevered push fingers formed on two adjacent walls for pushing the integrated circuit module toward opposing walls. At least a support device formed on the bottom of the push finger.
Public/Granted literature
- US20080220627A1 IC package having improved structure Public/Granted day:2008-09-11
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