Invention Grant
- Patent Title: Plating bath and surface treatment compositions for thin film deposition
- Patent Title (中): 电镀液和表面处理组合物用于薄膜沉积
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Application No.: US11433825Application Date: 2006-05-15
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Publication No.: US07655081B2Publication Date: 2010-02-02
- Inventor: Haixia Dai , Khashayar Pakbaz , Michael Spaid , Theo Nikiforov
- Applicant: Haixia Dai , Khashayar Pakbaz , Michael Spaid , Theo Nikiforov
- Applicant Address: US CA Mountain View
- Assignee: Siluria Technologies, Inc.
- Current Assignee: Siluria Technologies, Inc.
- Current Assignee Address: US CA Mountain View
- Agency: Foley & Lardner LLP
- Main IPC: C23C18/34
- IPC: C23C18/34 ; C23C18/36
Abstract:
An aqueous substrate surface treatment composition includes cysteine and an acidic solution having a pH of about 7 or less. The composition enables a selective deposition of a metal ion sensitizer and a subsequent selective plating of a metallic cap layer. Various CoWP plating bath compositions are also provided which may be used to form the cap layer.
Public/Granted literature
- US20060254504A1 Plating bath and surface treatment compositions for thin film deposition Public/Granted day:2006-11-16
Information query
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