An anisotropic conductive adhesive film and method for anisotropically and conductively connecting a connection terminal of a circuit board to a connection portion of an electronic device ensuring the fluidity of an anisotropic conductive adhesive film during electrical connection of the connection terminals of circuit boards to the connection portions of electronic devices using the anisotropic conductive adhesive film, in such a manner that the conductive particles are effectively confined, that the pressure required for compression bonding is not increased, and that the temporary bonding of the circuit boards to the electronic devices is effected at sufficient strength.