Invention Grant
- Patent Title: Plasma processing apparatus
- Patent Title (中): 等离子体处理装置
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Application No.: US11691700Application Date: 2007-03-27
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Publication No.: US07655110B2Publication Date: 2010-02-02
- Inventor: Yohei Yamazawa
- Applicant: Yohei Yamazawa
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-090243 20060329; JP2007-073575 20070320
- Main IPC: C23F1/00
- IPC: C23F1/00 ; H01L21/306

Abstract:
In the present invention, a probe which detects a time varying magnetic flux density in a direction around a center axis of a processing space is provided in a process vessel of a plasma processing apparatus. The probe detects an induced electromotive force generated in a coil as the time varying magnetic flux density, and a computer calculates an amount of radio-frequency current in the process vessel from the induced electromotive force, based on a predetermined calculation principle.
Public/Granted literature
- US20070227657A1 PLASMA PROCESSING APPARATUS Public/Granted day:2007-10-04
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