A molding compound formulation is provided that includes a unsaturated polyester, a low profile additive, and high surface area conductive carbon black particulate. The carbon black is dispersed in at least one of the unsaturated polyester and the low profile additive to produce a cured panel having a surface resistivity value of between 1×105-108Ω, and a Diffracto analysis D number of less than 100 when cured against a mold platen having a Diffracto analysis D number of 25. A process for producing such a molding compound panel is also provided that includes mixing through rotary mechanical stirring the high surface area conductive carbon black particulate into one side of the molding compound formulation under conditions that satisfy: ln(viscosity)≦−0.82{ln(RPM)}+12.734  (I) where viscosity is in Centipoise and RPM denotes revolutions per minute.