An overmolded electronic device includes a pre-mold assembly having a positioning pin that extends upward through a mold material into contact with an inner cavity of a mold. The positioning pin is disposed within a containment area that is defined by sets of ribs configured in and conformed on the pre-mold assembly. The positioning pin thereby is sealed within the containment area that is in turn sealed from the remainder of the electronic device that prevents the intrusion of moisture or other contaminants into undesirable locations of the electronic device.