Invention Grant
US07655485B2 Semiconductor layer formed by selective deposition and method for depositing semiconductor layer 有权
通过选择性沉积形成的半导体层和用于沉积半导体层的方法

  • Patent Title: Semiconductor layer formed by selective deposition and method for depositing semiconductor layer
  • Patent Title (中): 通过选择性沉积形成的半导体层和用于沉积半导体层的方法
  • Application No.: US11937921
    Application Date: 2007-11-09
  • Publication No.: US07655485B2
    Publication Date: 2010-02-02
  • Inventor: Akitaka Kimura
  • Applicant: Akitaka Kimura
  • Applicant Address: JP Tokyo
  • Assignee: NEC Corporation
  • Current Assignee: NEC Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Sughrue Mion, PLLC
  • Priority: JP9-264225 19970929
  • Main IPC: H01L21/20
  • IPC: H01L21/20
Semiconductor layer formed by selective deposition and method for depositing semiconductor layer
Abstract:
In a method for fabricating a nitride-based semiconductor laser which forms, by a selective deposition, a current narrowing structure and a structure confining a light in a horizontal direction in parallel to a substrate, when the nitride-based semiconductor is selectively deposited by a metal organic chemical vapor deposition, silicon generated by decomposition of the silicon oxide film used as the mask for the selective deposition is prevented from being deposited on a re-growth boundary. For this purpose, a silicon nitride film is used as the mask for the selective deposition, and when the nitride-based semiconductor is selectively deposited by the metal organic chemical vapor deposition, a V-group material of the nitride-based semiconductor, namely, a nitrogen material, for example, ammonia, is supplied so that the decomposition of the silicon nitride film used as the mask for the selective deposition, is prevented.
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