Invention Grant
US07655485B2 Semiconductor layer formed by selective deposition and method for depositing semiconductor layer
有权
通过选择性沉积形成的半导体层和用于沉积半导体层的方法
- Patent Title: Semiconductor layer formed by selective deposition and method for depositing semiconductor layer
- Patent Title (中): 通过选择性沉积形成的半导体层和用于沉积半导体层的方法
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Application No.: US11937921Application Date: 2007-11-09
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Publication No.: US07655485B2Publication Date: 2010-02-02
- Inventor: Akitaka Kimura
- Applicant: Akitaka Kimura
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP9-264225 19970929
- Main IPC: H01L21/20
- IPC: H01L21/20

Abstract:
In a method for fabricating a nitride-based semiconductor laser which forms, by a selective deposition, a current narrowing structure and a structure confining a light in a horizontal direction in parallel to a substrate, when the nitride-based semiconductor is selectively deposited by a metal organic chemical vapor deposition, silicon generated by decomposition of the silicon oxide film used as the mask for the selective deposition is prevented from being deposited on a re-growth boundary. For this purpose, a silicon nitride film is used as the mask for the selective deposition, and when the nitride-based semiconductor is selectively deposited by the metal organic chemical vapor deposition, a V-group material of the nitride-based semiconductor, namely, a nitrogen material, for example, ammonia, is supplied so that the decomposition of the silicon nitride film used as the mask for the selective deposition, is prevented.
Public/Granted literature
- US20080070336A1 SEMICONDUCTOR LAYER FORMED BY SELECTIVE DEPOSITION AND METHOD FOR DEPOSITING SEMICONDUCTOR LAYER Public/Granted day:2008-03-20
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