Invention Grant
US07655506B2 Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package
有权
无铅型半导体封装以及用于制造这种无引线型半导体封装的生产工艺
- Patent Title: Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package
- Patent Title (中): 无铅型半导体封装以及用于制造这种无引线型半导体封装的生产工艺
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Application No.: US11620481Application Date: 2007-01-05
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Publication No.: US07655506B2Publication Date: 2010-02-02
- Inventor: Yukinori Tabira
- Applicant: Yukinori Tabira
- Applicant Address: JP Tokyo
- Assignee: NEC Electronics Corporation
- Current Assignee: NEC Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2003-308571 20030901
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A leadless type resin-sealed semiconductor package includes a resin enveloper having a mounting face to be applied to a wiring board, and at least one side face associated with the mounting face to produce an angled side edge. A semiconductor chip is encapsulated and sealed in the resin enveloper. An electrode terminal is partially buried in the angled side edge of the resin enveloper so as to be exposed to an outside, with the electrode terminal being electrically connected to the semiconductor chip. The electrode terminal is formed with a depression which is shaped so as to be opened to an outside when the resin enveloper is placed on the wiring board such that the mounting face of the resin enveloper is applied thereto.
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Information query
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