Invention Grant
US07655508B2 Overmolding encapsulation process and encapsulated article made therefrom
失效
包覆成型包封工艺和由其制成的包封制品
- Patent Title: Overmolding encapsulation process and encapsulated article made therefrom
- Patent Title (中): 包覆成型包封工艺和由其制成的包封制品
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Application No.: US10894675Application Date: 2004-07-20
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Publication No.: US07655508B2Publication Date: 2010-02-02
- Inventor: Mark S. Johnson , Todd O. Bolken
- Applicant: Mark S. Johnson , Todd O. Bolken
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Jones Day
- Agent Edward L. Pencoske
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of encapsulating an article having first and second surfaces, includes positioning the article on a carrier such that at least a portion of the first surface contacts the carrier. A portion of the carrier carrying the article is then positioned within a mold and a seal is formed between the mold and the carrier. The mold is then filled with an encapsulating material to form a seal between the article and the carrier.
Public/Granted literature
- US20040266069A1 Overmolding encapsulation process and encapsulated article made therefrom Public/Granted day:2004-12-30
Information query
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