Invention Grant
- Patent Title: Method for manufacturing isolation layer having barrier layer formed thereon
- Patent Title (中): 制造其上形成有阻挡层的隔离层的方法
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Application No.: US11609866Application Date: 2006-12-12
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Publication No.: US07655524B2Publication Date: 2010-02-02
- Inventor: Jong Bok Lee
- Applicant: Jong Bok Lee
- Applicant Address: KR Seoul
- Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Sherr & Vaughn, PLLC
- Priority: KR10-2005-0129231 20051226
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
Embodiments relate to a semiconductor device and a method for manufacturing a semiconductor device. In embodiments, a transistor including the gate electrode and a source/drain may be formed between isolation layers and a contact may be connected to the source/drain. A barrier layer may be formed at a boundary between the isolation layer and the source/drain and may physically isolate the isolation layer from the source/drain.
Public/Granted literature
- US20070145490A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2007-06-28
Information query
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