A semiconductor device that prevents gate spacer stress and physical and chemical damages on a silicide region, and a method of manufacturing the same, according to an exemplary embodiment of the present invention, includes a substrate, isolation regions formed in the substrate, a gate pattern formed between the isolation regions on the substrate, an L-type spacer adjacent to the sidewall of the gate pattern and extended to the surface of the substrate, source/drain silicide regions formed on the substrate between the end of the L-type spacer extended to the surface of the substrate and the isolation regions, via plugs electrically connected with the source/drain silicide regions, an interlayer dielectric layer which is adjacent to the L-type spacer and which fills the space between the via plugs layer formed on the gate pattern and the substrate, and a signal-transfer line formed on the interlayer dielectric layer.