Invention Grant
US07655731B2 Soft polymer compositions having improved high temperature properties
失效
具有改善的高温性能的软质聚合物组合物
- Patent Title: Soft polymer compositions having improved high temperature properties
- Patent Title (中): 具有改善的高温性能的软质聚合物组合物
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Application No.: US11506553Application Date: 2006-08-18
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Publication No.: US07655731B2Publication Date: 2010-02-02
- Inventor: David J. Walsh
- Applicant: David J. Walsh
- Applicant Address: US DE Wilmington
- Assignee: E.I. du Pont de Nemours and Company
- Current Assignee: E.I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: C08L23/22
- IPC: C08L23/22 ; C08L31/04

Abstract:
Disclosed are soft polymer compositions comprising an ethylene/alkyl (meth)acrylate copolymer and a crystalline polyolefin, such as polypropylene homopolymers or polypropylene copolymers, wherein the ethylene/alkyl (meth)acrylate copolymer has a higher melt viscosity than the polyolefin. Also disclosed are such compositions modified by materials that improve the scratch-and-mar properties of the blends, the preparation and use of these compositions in such processes as extrusion and injection molding, and articles made from these compositions.
Public/Granted literature
- US20070049682A1 Soft polymer compositions having improved high temperature properties Public/Granted day:2007-03-01
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