Invention Grant
- Patent Title: Process for producing photoresist polymeric compounds
- Patent Title (中): 光致抗蚀剂聚合物的制备方法
-
Application No.: US12146594Application Date: 2008-06-26
-
Publication No.: US07655743B2Publication Date: 2010-02-02
- Inventor: Hitoshi Watanabe , Hidetaka Hayamizu , Masaaki Kishimura
- Applicant: Hitoshi Watanabe , Hidetaka Hayamizu , Masaaki Kishimura
- Applicant Address: JP Osaka
- Assignee: Daicel Chemical Industries, Ltd.
- Current Assignee: Daicel Chemical Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2002-098840 20020401; JP2002-098841 20020401
- Main IPC: C08F124/00
- IPC: C08F124/00

Abstract:
Process for producing photoresist polymeric compound having repeated units corresponding to at least one monomer selected from monomer (a) having lactone skeleton, monomer (b) having group which becomes soluble in alkali by elimination with acid, and monomer (c) having alicyclic skeleton having hydroxyl group. Process includes (A) polymerizing mixture of monomers containing at least one monomer selected from the above monomers (a), (b), and (c), and (B) extracting polymer formed in the polymerization by using organic solvent and water to partition the formed polymer into organic solvent layer and metal component impurity into aqueous layer, or passing polymer solution, which contains polymer having repeated units corresponding to at least one of the above monomers (a), (b), and (c) and metal content of which is 1000 ppb by weight or less relative to the polymer through filter comprising porous polyolefin membrane having cation-exchange group. The photoresist polymeric compounds have a metallic impurity content that is extremely low.
Public/Granted literature
- US20080268377A1 PROCESS FOR PRODUCING PHOTORESIST POLYMERIC COMPOUNDS Public/Granted day:2008-10-30
Information query
IPC分类: