Invention Grant
- Patent Title: Conductor for liquid-cooled windings
- Patent Title (中): 液冷绕组导体
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Application No.: US10595197Application Date: 2004-09-06
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Publication No.: US07655867B2Publication Date: 2010-02-02
- Inventor: Michael Schäfer
- Applicant: Michael Schäfer
- Applicant Address: DE Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE Munich
- Agency: King & Spalding L.L.P.
- Priority: DE10345664 20030905
- International Application: PCT/DE2004/002010 WO 20040906
- International Announcement: WO2005/031768 WO 20050407
- Main IPC: H01B7/00
- IPC: H01B7/00

Abstract:
A conductor for windings cooled by liquid, especially for transformer windings, has an insulating covering which surrounds the entire conductor (1). At least one layer (2) of the covering completely surrounds the conductor (1). An external layer (3) provided with at least two layers (2, 3) of the covering comprises openings (4), holes (5) or frays (6) through which a coolant flowing around the conductor is placed in a turbulent state and better heat exchange is obtained.
Public/Granted literature
- US20070277994A1 Conductor For Liquid-Cooled Windings Public/Granted day:2007-12-06
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