A wiring board is provided, where in the case where the wiring board and a piezoelectric element are connected via solder, the strength of connection in the peripheral region of the wiring board can be increased, and it is difficult for a connection defect to occur in the step of connecting the wiring board to the piezoelectric element. In addition, a manufacturing method for this wiring board is provided. The area of attaching portions 27b provided in the peripheral region of an insulating film 20 is made greater than that of attaching portions 27a provided in the inward region. In addition, the thickness of solder bumps 25b which are formed by providing solder to attaching portions 27b is made substantially the same as the thickness of solder bumps 25a which are formed by providing solder to attaching portions 27a.