Invention Grant
- Patent Title: Electronic parts packaging structure and method of manufacturing the same
- Patent Title (中): 电子零件包装结构及制造方法相同
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Application No.: US11485397Application Date: 2006-07-13
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Publication No.: US07656023B2Publication Date: 2010-02-02
- Inventor: Masahiro Sunohara , Mitsutoshi Higashi , Akinori Shiraishi
- Applicant: Masahiro Sunohara , Mitsutoshi Higashi , Akinori Shiraishi
- Applicant Address: JP Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano
- Agency: Edwards Angell Palmer & Dodge LLP
- Priority: JP2005-222973 20050801
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461
Abstract:
In an electronic parts packaging structure of the present invention, an electronic parts is mounted or formed on a silicon circuit substrate having a structure in which wiring layers on both sides thereof are connected to each other through a through electrode, and a protruded bonding portion which is ring-shaped and is made of glass, of a seal cap having a structure in which a cavity is constituted by the protruded bonding portion, is anodically bonded to a bonding portion of the silicon circuit substrate, thus, the electronic parts is hermetically sealed in the cavity of the sealing cap.
Public/Granted literature
- US20070029654A1 Electronic parts packaging structure and method of manufacturing the same Public/Granted day:2007-02-08
Information query
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