Invention Grant
US07656028B2 System for controlling the temperature of an associated electronic device using an enclosure having a working fluid arranged therein and a chemical compound in the working fluid that undergoes a reversible chemical reaction to move heat from the associated electronic device
有权
用于使用具有布置在其中的工作流体的外壳和在工作流体中的化学化合物控制相关联的电子设备的温度的系统，其经历可逆的化学反应以从相关的电子设备
- Patent Title: System for controlling the temperature of an associated electronic device using an enclosure having a working fluid arranged therein and a chemical compound in the working fluid that undergoes a reversible chemical reaction to move heat from the associated electronic device
- Patent Title (中): 用于使用具有布置在其中的工作流体的外壳和在工作流体中的化学化合物控制相关联的电子设备的温度的系统，其经历可逆的化学反应以从相关的电子设备
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Application No.: US11816674Application Date: 2006-02-21
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Publication No.: US07656028B2Publication Date: 2010-02-02
- Inventor: Wendy L. Wilkins , Barry K. Gilbert
- Applicant: Wendy L. Wilkins , Barry K. Gilbert
- Applicant Address: US MN Rochester
- Assignee: Mayo Foundation for Medical Education and Research
- Current Assignee: Mayo Foundation for Medical Education and Research
- Current Assignee Address: US MN Rochester
- Agency: Quarles & Brady LLP
- International Application: PCT/US2006/006126 WO 20060221
- International Announcement: WO2006/091603 WO 20060831
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/12 ; H01L23/10 ; H05K5/02 ; H05K7/20
Abstract:
A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a working fluid including a chemical compound that reacts endothermically to absorb heat produced by the devices and releases the heat in a reverse reaction to the enclosure.
Public/Granted literature
- US20080258295A1 Self-Contained Cooling Mechanism for Integrated Circuit Using a Reversible Endothermic Chemical Reaction Public/Granted day:2008-10-23
Information query
IPC分类:
