A semiconductor chip mounting wiring board 2 includes an insulating resin substrate 5, a first conductive bump 12 formed on one side of the insulative resin substrate 5 to mount a semiconductor chip 3, a wiring pattern 15 extending from the first conductive bump 12 toward the periphery of the insulating resin substrate 5, a filled viahole 9 leading from the other side of the insulating resin substrate 5 to the wiring pattern 15, and a second conductive bump 13, or a conductive pad 19, positioned just above the filled viahole 9 and electrically connected to the viahole 9. A semiconductor module is produced by mounting the semiconductor chip 3 in advance on the first conductive bump 12 on the semiconductor chip mounting wiring board 2 and stacking a plurality of the wiring boards 2 and interlayer members 20 each having an opening 27 to receive the semiconductor chip 3 and a conductive post 26 or conductive pad connected to the second conductive bump 13 of the wiring board 2 alternately on each other with an adhesive applied between them, placing another interconnecting circuit board such as an I/O wiring board 30 or the like on an outermost layer, and by applying hot-pressing to the stack. The semiconductor module thus produced has a high connection reliability and can be designed for a high mounting density and a lower profile.