Invention Grant
- Patent Title: Line component and semiconductor circuit using line component
- Patent Title (中): 线路元件和使用线路元件的半导体电路
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Application No.: US10545448Application Date: 2004-02-13
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Publication No.: US07656036B2Publication Date: 2010-02-02
- Inventor: Takashi Nakano , Hirokazu Tohya
- Applicant: Takashi Nakano , Hirokazu Tohya
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2003-037508 20030214
- International Application: PCT/JP2004/001556 WO 20040213
- International Announcement: WO2004/073066 WO 20040826
- Main IPC: H01L29/40
- IPC: H01L29/40

Abstract:
A semiconductor circuit in which low impedance characteristics required for a decoupling circuit are ensured up to a band of several hundreds of MHz or above in the situation where digital circuits are rushing into GHz age, and a semiconductor circuit exhibiting low impedance characteristics even in a band of several hundreds of MHz or above. A line element comprising a power supply line and a ground line or a ground plane arranged oppositely through a dielectric, characterized in that a dielectric covering the line element is provided.
Public/Granted literature
- US20060145309A1 Line element and semiconductor circuit applied with line element Public/Granted day:2006-07-06
Information query
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