Invention Grant
- Patent Title: Semiconductor device package and manufacturing method
- Patent Title (中): 半导体器件封装及制造方法
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Application No.: US11898006Application Date: 2007-09-07
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Publication No.: US07656047B2Publication Date: 2010-02-02
- Inventor: Jun Young Yang , You Ock Joo , You Pil Jung
- Applicant: Jun Young Yang , You Ock Joo , You Pil Jung
- Applicant Address: TW Kaohsing
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsing
- Agency: Cooley Godward Kronish LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A semiconductor device package includes a semiconductor device mounted and electrically coupled to a substrate, a package body encapsulating the semiconductor device against a portion of an upper surface of the substrate; and an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device. The electromagnetic interference shielding layer is a plated metal layer in contact with the package body, and the plated metal layer is connected to a ground trace extending on the upper surface of the substrate.
Public/Granted literature
- US20080042301A1 Semiconductor device package and manufacturing method Public/Granted day:2008-02-21
Information query
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