Invention Grant
- Patent Title: Laminated piezoelectric device
- Patent Title (中): 层压式压电装置
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Application No.: US10596475Application Date: 2004-12-17
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Publication No.: US07656077B2Publication Date: 2010-02-02
- Inventor: Takaaki Hira , Takeshi Okamura , Masaki Terazono , Hirotaka Tsuyoshi , Katsushi Sakaue
- Applicant: Takaaki Hira , Takeshi Okamura , Masaki Terazono , Hirotaka Tsuyoshi , Ryuusuke Tsuyoshi, legal representative , Katsushi Sakaue
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: Hogan & Hartson LLP
- Priority: JP2003-426902 20031224
- International Application: PCT/JP2004/019447 WO 20041217
- International Announcement: WO2005/062396 WO 20050707
- Main IPC: H01L41/047
- IPC: H01L41/047

Abstract:
A laminated piezoelectric device obtained by alternately laminating the piezoelectric layers containing Pb and the conducting layers containing palladium as a conducting component, wherein the piezoelectric layer formed between the two conducting layers has layer regions where Pb and Pd are mixed together in the interfacial portions thereof relative to the conducting layers, the layer regions having a thickness of not larger than 3% of the thickness of the piezoelectric layer. The laminated piezoelectric device is formed by co-firing the Pb-containing piezoelectric layers and the palladium (Pd)-containing layers, the piezoelectric layers therein having a large insulation resistance and good piezoelectric characteristics.
Public/Granted literature
- US20070209173A1 Laminated Piezoelectric Device Public/Granted day:2007-09-13
Information query
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