A manufacturing method of a semiconductor device employing a semiconductor inspection apparatus to accurately inspect semiconductor elements while still in the wafer state, the semiconductor inspection apparatus including: a probe sheet 31 having contact terminals 7 which contact electrodes 3 of a wafer 1 and contact bumps 20b electrically connected to respective contact terminals 7; and a probe sheet 34 which is backed by a metal film 30b and having contact electrodes 34a which contact the contact bumps 20b of the probe sheet 31 and peripheral electrodes 27b electrically connected to the respective contact electrodes 34a, the wafer 1 is interposed between the probe sheet 34 and the supporting member 33 via the probe sheet 31 by reducing pressure through vacuuming, and the contact terminals 7 which have a pyramidal or truncated shape are contacted to the electrodes 3 of the wafer 1 at a desired atmospheric pressure, thereby performing the inspection.