Invention Grant
- Patent Title: Burn-in board connection device and method
- Patent Title (中): 老化板连接装置及方法
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Application No.: US11937342Application Date: 2007-11-08
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Publication No.: US07656180B2Publication Date: 2010-02-02
- Inventor: Jae-Nam Lee , Jung-Hyeon Kim , Ju-II Kang , Jin-Woo Yang
- Applicant: Jae-Nam Lee , Jung-Hyeon Kim , Ju-II Kang , Jin-Woo Yang
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Inc.
- Current Assignee: Samsung Electronics Co., Inc.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Marger Johnson & McCollom, P.C.
- Priority: KR10-2006-0123378 20061206
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
A burn-in board connection device includes a first connection unit to hold a burn-in board and move in a first direction perpendicular to the burn-in board that is inserted in a chamber of a burn-in test device, a second connection unit to move in a second direction parallel to the burn-in board to attach/detach the burn-in board that is held by the first connection unit to/from a connector disposed in the chamber. A burn-in board connection method includes coupling a finger to the burn-in board by moving the finger in a first direction, attaching the burn-in board to a connector by moving the finger in a second direction, and driving the finger by converting a rotation of a servo motor into a linear movement of the finger.
Public/Granted literature
- US20080139024A1 BURN-IN BOARD CONNECTION DEVICE AND METHOD Public/Granted day:2008-06-12
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