A chip device having a ground electrode and a plurality of top-surface electrodes on a plate-like dielectric substrate. Two of the top-surface electrodes are connected to the ground electrode via respective short-circuit side-surface electrodes to form quarter wavelength resonant lines. A third top-surface electrode is provided between the two top-surface electrodes and both ends thereof are opened to form a half wavelength resonant line. The two top-surface electrodes each have a parallel portion arranged near and in parallel to the third top-surface electrode and a flexion that curves from the parallel portion, extends toward the remaining of the two top-surface electrodes, and is jump-coupled to the remaining of the two top-surface electrodes. The short-circuit side-surface electrodes are jump-coupled to each other, like the flexions.