Invention Grant
US07656669B2 Scalable computer system and reconfigurable chassis module thereof
有权
可扩展计算机系统及其可重构机箱模块
- Patent Title: Scalable computer system and reconfigurable chassis module thereof
- Patent Title (中): 可扩展计算机系统及其可重构机箱模块
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Application No.: US11554375Application Date: 2006-10-30
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Publication No.: US07656669B2Publication Date: 2010-02-02
- Inventor: Mario J. D. Lee , Tomonori Hirai , Jyh Ming Jong
- Applicant: Mario J. D. Lee , Tomonori Hirai , Jyh Ming Jong
- Applicant Address: TW Taoyuan
- Assignee: Mitac International Corp.
- Current Assignee: Mitac International Corp.
- Current Assignee Address: TW Taoyuan
- Agency: Quintero Law Office
- Main IPC: H05K7/14
- IPC: H05K7/14

Abstract:
A scalable computer system includes a reconfigurable chassis module, plural hardware units and one or more inter-plane. The chassis module has plural modular units for configuring the hardware units therein respectively. Each of the modular units has dedicated framework to attach the inter-plane or dedicated fans. The inter-plane is to connect with the separated hardware units between the modular units. Each of the modular units is equipped with compatible male and female joints to engage with each other. Certain fastening assemblies may be applied to secure male-male or female-female joints, thereby enabling the modular units to be front-to-back and/or side-by-side connections.
Public/Granted literature
- US20080043427A1 Scalable Computer System and Reconfigurable Chassis Module Thereof Public/Granted day:2008-02-21
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