Invention Grant
- Patent Title: Radiation-hardened programmable device
- Patent Title (中): 辐射硬化可编程器件
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Application No.: US11774502Application Date: 2007-07-06
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Publication No.: US07656699B2Publication Date: 2010-02-02
- Inventor: Harry N. Gardner , David Kerwin
- Applicant: Harry N. Gardner , David Kerwin
- Applicant Address: US CO Colorado Springs
- Assignee: Aeroflex UTMC Microelectronics Systems, Inc.
- Current Assignee: Aeroflex UTMC Microelectronics Systems, Inc.
- Current Assignee Address: US CO Colorado Springs
- Agency: Hogan & Hartson LLP
- Agent Peter J. Meza; William J. Kubida
- Main IPC: G11C11/00
- IPC: G11C11/00

Abstract:
A method of programming a radiation-hardened integrated circuit includes the steps of supplying a prototype device including an SRAM memory circuit or programmable key circuit to a customer, having the customer develop working data patterns in the field in the same manner as a reading and writing to a normal RAM memory, having the customer save the final debugged data pattern, delivering the data pattern to the factory, loading the customer-developed data pattern into memory, programming the customer-developed data pattern into a number of production circuits, irradiating the production circuits at a total dosage of between 300K and 1 Meg RAD to burn the data pattern into memory, and shipping the irradiated and programmed parts to the customer.
Public/Granted literature
- US20080014531A1 RADIATION-HARDENED PROGRAMMABLE DEVICE Public/Granted day:2008-01-17
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