Invention Grant
- Patent Title: Semiconductor laser device and method for manufacturing the same semiconductor laser device
- Patent Title (中): 半导体激光器件及其制造方法
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Application No.: US11397680Application Date: 2006-04-05
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Publication No.: US07656921B2Publication Date: 2010-02-02
- Inventor: Chikara Watatani
- Applicant: Chikara Watatani
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2005-233045 20050811
- Main IPC: H01S5/00
- IPC: H01S5/00

Abstract:
A current blocking structure of a semiconductor laser includes a p-type InP buried layer, an n-type InP current blocking layer, and a p-type InP current blocking layer laminated along the mesa side surface of a ridge. In the structure, an upper end part of the n-type InP current blocking layer is covered with the p-type InP buried layer and the p-type InP current blocking layer. The n-type InP current blocking layer is prevented from contacting n-type and p-type InP cladding layers. Creation of an ineffective current path from one of the n-type InP cladding layers through the n-type InP current blocking layer to a p-type InP cladding layer of the semiconductor laser is prevented.
Public/Granted literature
- US20070091957A1 Semiconductor laser device and method for manufacturing the same semiconductor laser device Public/Granted day:2007-04-26
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