Invention Grant
- Patent Title: Microphone module and method for fabricating the same
- Patent Title (中): 麦克风模块及其制造方法
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Application No.: US11457847Application Date: 2006-07-17
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Publication No.: US07657025B2Publication Date: 2010-02-02
- Inventor: Wei-Chan Hsu , Li-Te Wu , Bing-Ming Ho
- Applicant: Wei-Chan Hsu , Li-Te Wu , Bing-Ming Ho
- Applicant Address: US CA Cupertino
- Assignee: Fortemedia, Inc.
- Current Assignee: Fortemedia, Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Main IPC: H04M1/00
- IPC: H04M1/00 ; H04M9/00 ; H04R25/00
Abstract:
A microphone module. The module comprises a carrier having a first side and an opposing second side and comprising a through hole. A microphone is disposed on the first side of the carrier and corresponding to the through hole. A processing chip is disposed on the first side of the carrier and coupled to the microphone. An encapsulant is disposed on the first side of the carrier to encapsulate the microphone and the processing chip.
Public/Granted literature
- US20080037768A1 MICROPHONE MODULE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2008-02-14
Information query
