Invention Grant
- Patent Title: Implantable medical lead including a helical fixation member
- Patent Title (中): 可植入医用铅包括螺旋固定件
-
Application No.: US11323016Application Date: 2005-12-30
-
Publication No.: US07657325B2Publication Date: 2010-02-02
- Inventor: Terrell M. Williams
- Applicant: Terrell M. Williams
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Carol F. Barry
- Main IPC: A61N1/05
- IPC: A61N1/05
Abstract:
An implantable medical lead comprises an elongated body extending between a proximal end and a distal end, and a helical fixation member extending from the distal end of the elongated body. The helical fixation member is configured to fix the implantable medical lead at an implant site and includes a tip comprising a first surface generally facing a center axis of the helical fixation member.
Public/Granted literature
- US20070156218A1 Implantable medical lead including a helical fixation member Public/Granted day:2007-07-05
Information query
