Invention Grant
US07657343B2 Assembling system, assembling unit, layout arranging system and layout arranging method
有权
组装系统，组装单元，布置布置系统和布局布置方法
- Patent Title: Assembling system, assembling unit, layout arranging system and layout arranging method
- Patent Title (中): 组装系统，组装单元，布置布置系统和布局布置方法
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Application No.: US11292005Application Date: 2005-12-02
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Publication No.: US07657343B2Publication Date: 2010-02-02
- Inventor: Katsuo Saito , Motoyasu Ohata
- Applicant: Katsuo Saito , Motoyasu Ohata
- Applicant Address: JP Shinagawa-Ku, Tokyo
- Assignee: Hirata Corporation
- Current Assignee: Hirata Corporation
- Current Assignee Address: JP Shinagawa-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Main IPC: G06F7/00
- IPC: G06F7/00
Abstract:
A layout arranging system doing automatic layout of a system being constituted of assembling units. More particularly, a layout arranging system (102) communicable with a plurality of connectable conveyors (C/V 1-12), comprising a module for recognizing connected conveyors (C/V 1-12), a module for acquiring information concerning recognized conveyors (C/V 1-12), and a module for laying out the recognized conveyors (C/V 1-12).
Public/Granted literature
- US20060080827A1 Assembling system, assembling unit, layout arranging system and layout arranging method Public/Granted day:2006-04-20
Information query
