Invention Grant
- Patent Title: High-level bridge from PCIE to extended USB
- Patent Title (中): 从PCIE到扩展USB的高级桥
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Application No.: US11926636Application Date: 2007-10-29
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Publication No.: US07657692B2Publication Date: 2010-02-02
- Inventor: Charles C. Lee , David Q. Chow , Abraham C. Ma , Frank Yu , Ming-Shiang Shen , Horng-Yee Chou
- Applicant: Charles C. Lee , David Q. Chow , Abraham C. Ma , Frank Yu , Ming-Shiang Shen , Horng-Yee Chou
- Applicant Address: US CA San Jose
- Assignee: Super Talent Electronics, Inc.
- Current Assignee: Super Talent Electronics, Inc.
- Current Assignee Address: US CA San Jose
- Agency: g Patent LLC
- Agent Stuart T. Auvinen
- Main IPC: G06F13/00
- IPC: G06F13/00

Abstract:
An extended universal-serial bus (EUSB) bridge to a host computer can have peripheral component interconnect express (PCIE) protocol layers on one side of the bridge, and EUSB layers on the other side of the bridge, with a high-level bridging converter module connecting the upper layers. The PCIE physical, data-link, and transport layers may be eliminated by integrating the bridge with an I/O controller. PCIE requests and data payloads are directly sent to the bridge, rather than low-level PCIE physical signals. The PCIE data payloads are converted to EUSB data payloads by a high-level direct bridging converter module. Then the EUSB data payloads are passed down to an EUSB transaction layer, an EUSB data-link layer, and an EUSB physical layer which drives and senses physical electrical signals on both differential pairs of the EUSB bus.
Public/Granted literature
- US20080065796A1 High-Level Bridge From PCIE to Extended USB Public/Granted day:2008-03-13
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