Invention Grant
- Patent Title: Automated electrostatic discharge structure placement and routing in an integrated circuit
- Patent Title (中): 在集成电路中自动静电放电结构放置和布线
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Application No.: US11565023Application Date: 2006-11-30
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Publication No.: US07657858B2Publication Date: 2010-02-02
- Inventor: Youang Pin Chen , Sireesha Tulluri Lakshmi Naga Venkata Srujana , Nirav Patel , Raghunatha Reddy Lakki Reddy , Sivaramakrishnan Subramanian , Venkat Rao Vallapaneni
- Applicant: Youang Pin Chen , Sireesha Tulluri Lakshmi Naga Venkata Srujana , Nirav Patel , Raghunatha Reddy Lakki Reddy , Sivaramakrishnan Subramanian , Venkat Rao Vallapaneni
- Applicant Address: US PA Allentown
- Assignee: Agere Systems Inc.
- Current Assignee: Agere Systems Inc.
- Current Assignee Address: US PA Allentown
- Agency: Ryan, Mason & Lewis, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A processor-implemented means of designing a power pad layout includes determining a location of at least one ESD structure so as to minimize a placement cost and determining a location of at least one connection between the at least one ESD structure and at least one power ring. The step of determining a location of at least one connection between the ESD structure and at least one power ring may include the steps of determining a minimum spanning tree of elements associated with a given power ring; and back-tracing through a minimum spanning tree of elements associated with a given power ring in order to determine a minimal list of routed paths among the elements.
Public/Granted literature
- US20080134119A1 Automated Electrostatic Discharge Structure Placement and Routing in an Integrated Circuit Public/Granted day:2008-06-05
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